Molded resin composition exhibiting good adhesion to conductive material on a surface

ABSTRACT

A resin matrix with resistances to alkali and acid includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative component particles have a particle diameter in the range of 1-20 micrometers.

RELATED APPLICATION

[0001] This application is a divisional of co-pending Application Ser.No. 08/986,104, filed on Dec. 5, 1997, the entire contents of which arehereby incorporated by reference

BACKGROUND OF THE INVENTION

[0002] The present invention relates to a resin composition, and moreparticularly to a resin composition exhibiting a good adhesion when asurface of the resin composition is subjected to a wet processing forforming a conductor on a surface of the molded resin composition.

[0003] A plating process has been developed for the purpose ofpreventing static electricity on the surface of a molded resincomposition. This plating process is also made for forming a patternedconductor on a predetermined part of the molded resin compositionsurface, typically forming a printed wiring board. Such platingprocesses may be isolated into two processes. The first one is a dryprocess using thin film technologies of such as evaporation andsputtering. The second one is a wet process, wherein a catalyst core isadsorbed on the resin composition surface, and the resin composition issubsequently immersed into an electroless plating bath for precipitationof electroless plating. If the dry process is used, then the maximumthickness of the conducive film is only a few micrometers, namely it isdifficult to form a thin conductive film. This means that the thickconductive film is formed in the wiring board, then the impedance of thewiring is high, namely it is difficult to reduce the impedance of theconductive film wiring on the wiring board. On the other hand, the dryprocess allows a good adhesion of conductor with the resin composition.However, the dry process is inferior in the productivity and costperformance, for which reason the dry process is not suitable for massproduction at low cost.

[0004] Namely, the wet process is superior in cost performance butinferior in adhesion between resin composition and conductor. In orderto improve the adhesion between resin composition and conductor, it isrequired to provide a roughness to the surface of the resin composition.Available methods for providing the roughness to the resin compositionsurface would be isolated into two typical ones. The first one is themechanical and physical method. The second one is the chemical methodusing wet etching by chemical etchants. The mechanical and physicalmethod is somewhat inferior in uniformity of roughness and adhesion tothe fine patterns is not uniform. It is also difficult to obtain asufficiently high adhesion with a hard resin. On the other hand, thechemical method is ineffective with chemical-resistant resins.

[0005] Some typical electroless plating processes for resin surface willbe described.

EXAMPLE 1 Co-polymerization of resin matrix with components to becorroded by chemicals

[0006] The following description will be made in the case ofacrylonitrile-butadiene-styrene resin (ABS resin). This resin has anisland structure wherein the rubber component of butadiene is dispersedin the form of spherical particles in a body of acrylonitrile-butadiene(AB). If this resin is immersed in an oxidizing etchant, then the rubbercomponent in the form of spherical particles positioned in the vicinityof surfaces of the body is selectively oxidized and dissolved into theetchant, whereby the surface of the resin is made rough. The plated filmof conductor is securely engaged with the rough surface of the resin bythe anchor effect.

[0007] It is known in the art to make the adhesive layer rough. InJapanese patent publication Nos. 63-10752 and Japanese laid-open patentpublication No. 3-18096, it is disclosed that the rubber component ofthe acrylonitrile-butadiene-styrene rubbers is introduced into theadhesive of epoxy resins to obtain the same effect as described above.

[0008] Chromatic acid is used as an oxidizing etchant for selectingetching the rubber component dispersed in the form of sphericalparticles. The use of chromatic acid as the oxidizing etchant is notpreferable in the light of recently required reduction of environmentalpollution. Blending rubber component reduces heat resistivity, stabilityin size, and insulation performance or anti-migration performance.

EXAMPLE 2 Blending resin matrix with inorganic insulator to be dissolvedinto chemicals

[0009] In Japanese laid-open patent publication No. 60-167492, it isdisclosed that an inorganic insulator is used to be selectively etchedby chemicals. Glass, magnesium oxide and calcium carbonate are, forexample, available to obtain a desired adhesion.

[0010] Since such inorganic insulators, however, include alkali metalsor alkali earth metals, there is raised a problem with deterioration inmoisture resistance of the resin. For this reason, it is preferable tonot include a large amount of such inorganic insulators into the resin.Further, generally, the inorganic insulator has a larger specificgravity than resins. Particularly if liquid inorganic insulators such asvarnish are used, then the inorganic insulator is non-uniformly presentin the resin matrix, and the probability of the inorganic insulatorexisting in the vicinity of the surface of the resin matrix is lower.

[0011] In the above circumstances, it was required to develop a novelresin composition free from the above problems and a novel method offorming a conductor on a surface of the resin component.

SUMMARY OF THE INVENTION

[0012] Accordingly, it is an object of the present invention to providea novel resin composition free from the above problems.

[0013] It is a further object of the present invention to provide anovel resin composition on which a conductor fine pattern is adhered ata high adhesion.

[0014] It is a still further object of the present invention to providea novel resin composition having a surface allowing good adhesion to aconductor.

[0015] It is yet a further object of the present invention to provide anovel resin composition having good production yield.

[0016] It is a further more object of the present invention to provide anovel resin composition which may be produced at a low cost.

[0017] It is still more object of the present invention to provide anovel method of forming a conductor on a surface of a resin compositionfree form the above problems.

[0018] It is moreover object of the present invention to provide a novelmethod of forming a conductor on a surface of a resin composition with agood adhesion.

[0019] It is another object of the present invention to provide a novelmethod of forming a conductor on a surface of a resin composition at alow cost.

[0020] It is still another object of the present invention to provide anovel high production yield method of forming a conductor on a surfaceof a resin composition.

[0021] The above and other objects, features and advantages of thepresent invention will be apparent from the following descriptions.

[0022] In accordance with the present invention, a resin matrix withresistances to alkali and acid includes at least any one of insulativeorganic particles and insulative composite particles having an organiccomponent and an inorganic component at a total amount in the range of5-50% by volume, wherein the insulative organic particles and theorganic component of the insulative composite particles are allowed tobe corroded by either alkali or acid, and wherein not less than 90% byvolume of any one of the insulative organic particles and insulativecomposite particles has a particle diameter in the range of 1-20micrometers.

[0023] It is preferable that the insulative organic particles and theorganic component of the insulative composite particles comprise athermoplastic amorphous polymer which has a glass transition temperatureof not less than 90° C.

[0024] It is also preferable that the insulative organic particles andthe organic component of the insulative composite particles comprise athermoplastic crystal polymer which has a melting point of not less than110° C.

[0025] It is also preferable that the insulative organic particles andthe organic component of the insulative composite particles comprise athermosetting polymer.

[0026] It is also preferable that parts of the insulative organicparticles and the insulative composite particles comprise hollowparticles.

[0027] It is also preferable that each of the insulative compositeparticles comprise inorganic core particles coated with a thermoplasticpolymer layer.

[0028] It is also preferable that each of the insulative compositeparticles comprise inorganic core particles coated with a thermosettingpolymer layer.

[0029] It is also preferable that each of the insulative compositeparticles comprise a homogeneous organic particle coated with calciumcarbonate at an amount of 25% by weight or less.

[0030] It is also preferable that each of the insulative compositeparticles comprise a hollow organic particle coated with calciumcarbonate at an amount of 25% by weight or less.

[0031] It is also preferable that the resin matrix has aphotosensitivity.

[0032] It is also preferable that the resin matrix with thephotosensitivity is any one of epoxy-acrylate having fluorene skeletonand benzocyclobutene and the organic particles and the organic componentof the composite particles are at least one thermoplastic polymerselected from the group consisting of polymethylmethacrylate,polyacrylonitrile, polystyrene, nylon, polycarbonate, and polyvinylidenechloride.

[0033] It is also preferable that the resin matrix with thephotosensitivity is any one of epoxy-acrylate having fluorene skeletonand benzocyclobutene and the organic particles and the organic componentof the composite particles are at least one thermosetting polymerselected from the group consisting of epoxy resin, phenol resin, anddiarylphthalate resin.

[0034] In accordance with the present invention, a method of forming aconductor on a surface of a resin composition comprises the steps of:

[0035] molding a resin which includes at least any one of insulativeorganic particles and insulative composite particles having an organiccomponent and an inorganic component at a total amount in the range of5-50% by volume, wherein the organic particles and the organic componentof the composite particles are allowed to be corroded by either alkalior acid and wherein not less than 90% by volume of said at least any oneof said insulative organic particles and said insulative compositeparticles has a particle diameter in the range of 1-20 micrometers;

[0036] exposing the resin to at least any one of an acid solution and analkali solution to make a surface of the molded resin rough; and

[0037] subjecting the rough surface of the molded resin to anelectroless plating for subsequent heat treatment of the resin.

[0038] It is preferable that the acid solution and the alkali solutionare permanganate and a neutralizing solution thereof. Permanganate isused as a chemical for desmear treatment.

DISCLOSURE OF THE INVENTION

[0039] In accordance with the present invention, a resin matrix has atleast any one of resistances to alkali and acid. The resins withresistance to acid may, for example, be epoxy-acrylate, and polyamideimide. The resins with resistance to alkali may, for example, bepolystyrene, and nylon. The resins with resistances to both alkali andacid may, for example, be polypropylene, polyester, epoxy resin,polyimide, and benzocyclobutene. Particularly, epoxy-acrylate havingfluorene skeleton and benzocyclobutene are preferable due to those highglass transition temperature and high hydrophobicity. The organicparticles and the organic component of the composite particles areallowed to be corroded by either alkali or acid relative to the resinmatrix. Thermoplastic polymers may, for example, be selected frompolymethylmethacrylate, acryl resins such as polyacrylonitrile,polystyrene, polycarbonate, and acetal resins.

[0040] It is preferable that the organic particles and the organiccomponent of the composite particles comprise a thermoplastic amorphouspolymer which has a glass transition temperature of not less than 90° C.

[0041] It is also preferable that the organic particles and the organiccomponent of the composite particles comprise a thermoplastic crystalpolymer which has a melting point of not less than 110° C.

[0042] In the method of forming the conductor on the surface of theresin, after the rough surface of the molded resin is subjected to theelectroless plating, heat treatment of the resin is carried out toremove moisture from the molded resin for improvement in the adhesion ofthe surface of the resin. The heat treatment is preferably carried outat not less than 90° C. If the glass transition temperature is less than90° C., or a melting point is less than 110° C., then any deformationsuch as expansion may appear on the surface of the molded resin.

[0043] If the resin matrix comprises a thermoplastic polymer, then thethermoplastic polymer has a glass transition temperature of not lessthan 90° C., and a melting point is less than 110° C. If the glasstransition and melting point temperatures are lower than the above, thendeformation may appear due to heat treatment.

[0044] Generally, thermosetting resins have a bridge structure, forwhich reason the thermosetting resins are superior in resistance tochemicals. It is preferable to not roughen the surface of the resin in ashort time. However, if the high heat resistance and size stability arerequired, then those thermosetting resins are superior than thethermoplastic resins. It is, therefore, preferable to blend thethermosetting resins, even if the time for roughening the surface of theresin is somewhat long. The resin matrix of epoxy-acrylate havingfluorene skeleton and benzocyclobutene having a high glass transitiontemperature is blended with thermosetting resin such as epoxy resin,phenol resin, and diarylphthalate resin to obtain higher properties thanwhen the thermosetting resin is used alone and obtain better adhesion.

[0045] On the other hand, the inorganic component of the compositeparticles is not limited when used as core particles coated with anorganic component to be corroded by acid and alkali solutions. In thiscase, the organic component is corroded, and the core particle is alsoremoved, thereby exhibiting roughness effects. If the inorganiccomponent is used for coating the core particles, then calcium carbonateis preferable due to its high solubility. Since, however, calciumcarbonate includes alkali earth metals, the moisture resistance might bedropped. It is preferable to not use a large amount of calcium carbonatealone. It is preferable to reduce the blending amount of calciumcarbonate to 25% by weight or less. The hollow particles are effectivefor shortening the corrosion time and reducing the blending amountthereof. The hollow particles have low specific gravity, and theparticles are likely to be localized on the surface region of theparticles. This makes it easy to obtain a rough surface on the resin.The blending amount of the particles is in the range of 5-50% by volume.If the blending amount is less than 5% by volume, then it is difficultto obtain the desired rough surface o the resin necessary for goodadhesion to the conductor. If the blending amount is more than 50% byvolume, then the properties of the resin matrix are remarkably changed.Not less than 90% by volume of the particles have a particle diameter inthe range of 1-20 micrometers. Preferably, not less than 95% by volumeof the particles have a particle diameter in the range of 3-15micrometers. More preferably, not less than 98% by volume of theparticles have a particle diameter in the range of 5-10 micrometers. Ifthe diameter is less than 1 micrometer, then it is difficult to obtain asufficiently rough surface on the resin for required adhesion to theconductor. If the diameter is more than 20 micrometers, then the surfaceroughness is too great to form fine interconnections on the surface.

[0046] It is possible to add insulative particles to the resincomposition other than the particles to be corroded by alkali and acidsolutions. In order to reinforce the molded resin and obtain dimensionstability as well as improve heat conductivity, inorganic particles suchas silica, alumina, titanium oxide, and boron nitride may be included.It is also possible to include additives such as flame retardant,coloring agent, ultraviolet ray absorbent agent, and an antistaticagent.

[0047] The chemicals to be used for corrosion are acid and alkalisolutions. In view of prevention of environmental pollution, it ispreferable to not use organic solvents. For example, mineral acids suchas sulfuric acid, and hydrochloric acid may be included, and anoxidizing agent may also be included. As an alkali, sodium hydroxide isgenerally used. Permanganate is used as a chemical for desmear treatmentto remove residual resin to obtain good adhesion for deposition of theelectroless plating. The desmear treatment comprises three steps ofswelling the resin with an alkali solution containing a small amount oforganic solvent, etching by an alkali solution of permanganate, andneutralizing for removal of residual manganese. Therefore, this processmay be applicable to either particles to be corroded by any one of acidand alkali solutions. In accordance with the swelling and solubility,the immersion of the resin in the chemicals is carried out for a fewminutes to several tens of minutes. In the interval between theseimmersion processes, the resin needs to be washed by water. Further, itis possible for pre-treatment or post-treatment with alkali solution,before or after the desmear treatment.

[0048] The method of forming the conductor on the resin surface will bedescribed. The method comprises three steps of molding the resin, makingthe surface of molded resin rough with at least one of alkali and acidsolutions, and subjecting the surface thereof to electroless plating forsubsequent heat treatment.

[0049] The method of molding is not limited. If the resin matrix isthermoplastic polymer, then it is possible to melt the resin compositionto mold the resin in the desired shape. It is also possible to dissolvethe resin composition into the solvent to apply on the substratesurface, or to inject into dies for subsequent volatilization If theresin matrix is the thermosetting polymer or non-thermoplastic polymer,it is possible to apply precursor varnish on the substrate surface forsubsequent thermosetting by heat, light and radioactive ray.

[0050] The surface of the molded resin is made rough for good adhesionwith the electroless plated conductor by use of acid or alkalisolutions. Permanganate is used as a chemical for desmear treatment.Further, prior to the desmear treatment, a mechanical polishing such asbuff polishing is preferably carried out for obtaining the surfaceroughness. Particularly, if the surface is hard and the resistance tochemicals is high, the resin thin film is polished for removal thereofto show the particle surface.

[0051] The rough surface of the resin is subjected to the electrolessplating. In order to carry out the electroless plating, it is requiredto add to the substrate surface a catalyst causing plating reaction byvarious methods. As the catalyst, noble metals such as palladium areavailable. Particularly, palladium of colloidal type is often used. Itis also possible to carry out the sensitizing by immersion of the resininto stannic chloride solution and subsequent activation by immersioninto palladium chloride. It is further possible to immerse the resininto metal salt solution such as copper solution and nickel solutionbefore reduction thereof for deposition of the metal, and subsequentpalladium-replacement plating in the palladium chloride solution.

[0052] After the catalyst is added, the electroless plating is carriedout. Materials for plating are not limited and are selectable inaccordance with various uses. If interconnections of the printed wiringboard are formed, copper is preferable due to its low cost and lowresistance. Nickel and gold are also available. Since the electrolessplating is inferior in deposition rate, electroplating may be carriedout following the electroless plating.

[0053] If the conductive pattern is formed, photo-resist may be used forselective etching of the conductive film. Alternatively, only thenecessary part of the conductive film is deposited after addition of thecatalyst.

[0054] Heat treatment is accomplished for improvement in adhesionbetween the molded resin surface and the plated film by removal ofmoisture from the interface between the molded resin surface and theplated film. The heat treatment is preferably carried out at atemperature of not less than 90° C., but not rapidly to preventexpansion of the plated film. Gradual heating is preferable. If arelatively small area pattern is preliminary formed, a rapid heating isalso possible due to a sufficient pass for removing moisture.

EXAMPLE 1

[0055] 100 parts by weight of a varnish available from Shin-NihonSeitetu and containing 50% by weight of epoxy-acrylate having fluoreneskeleton as resin solid component were blended with 20 parts by weightof bridged polymethylmethacrylate particles (M-305, diameter; 5-20micrometers) available from Matumoto Oils and Fats Pharmaceutical forsubsequent stirring in mixture for 20 minutes to obtain a uniformdispersion of the particles. This varnish of 40 micrometers in thicknesswas then applied onto an FR-4 unclad plate surface by curtain coater forsubsequent pre-baking at 75° C. for 25 minutes before exposure at 500mj/cm² prior to a thermosetting at 160° C. for 30 minutes. A glasstransition temperature of the resin after thermosetting was 180° C.

[0056] Subsequently, the resin surface was polished by #600 buff to makethe surface rough before desmear chemicals were used for swelling,etching,. and neutralizing processes.

[0057] A solution containing 0.05 mol of copper nitrate was applied tothe rough surface for subsequent heat treatment at 150° C. for 3 hours,and oxygen-plasma treatment for 1 minute. Thereafter, particle freeepoxy-acrylate varnish having a fluorene skeleton was treated in thesame manner a described above until accomplishment of pre-bakingprocesses for exposure through mask pattern and subsequent developmentwith a solution containing 1% by weight of sodium carbonate for 5minutes.

[0058] This substrate was reduced in a solution containing 1 g/l ofboron sodium hydride for 10 minutes to deposit metals in the patternsfor subsequent washing by water before immersion into electroless copperplating solution KC-500 (available from Japan Energy) for 4 hours todeposit 20 micrometers-thick electroless copper and subsequent heattreatment at 150° C. for 1 hour.

[0059] 90 degree peel strength test was carried out to confirm astrength of at least 1 kg/cm.

EXAMPLE 2

[0060] In place of bridged polymethylmethacrylate particles (M-305,diameter; 5-20 micrometers), nylon 12 particles (orgasole 2001,diameter; 8-12 micrometers, melting point: 175-179° C.) was used. Otherconditions are the same as Example 1.

[0061] 90 degree peel strength test was carried out to confirm astrength of at least 0.9 kg/cm.

EXAMPLE 3

[0062] In place of bridged polymethylmethacrylate particles (M-305,diameter; 5-20 micrometers), composite particles of 7-10 micrometers indiameter comprising titanium oxide core particles of 3-5 micrometers indiameter coated with nylon 12 were blended by 25 parts by weight. Otherconditions are the same as Example 1.

[0063] 90 degree peel strength test was carried out to confirm astrength of at least 0.9 kg/cm.

EXAMPLE 4

[0064] In place of bridged polymethylmethacrylate particles (M-305,diameter; 5-20 micrometers), phenol resin particles of 13-15 micrometersin diameter were used and the etching process is carried out for twiceas long. Other conditions are the same as Example 1.

[0065] 90 degree peel strength test was carried out to confirm astrength of at least 1 kg/cm.

EXAMPLE 5

[0066] 100 parts by weight of a photosensitive benzocyclobutene varnishbeing available from Dow Chemicals was blended with 20 parts by weightof calcium carbonate-treated bridge polymethylmethacrylate particles(M-305C, calcium carbonate/polymethylmethacrylate; {fraction (2/8)} inpercent by weight) for subsequent stirring by mixture for 30 minutes toobtain a uniform dispersion of the particles. An alumina ceramicsubstrate is applied with 1 wt-% 3-aminopropyltriethoxysilane solutionto spin-coat this varnish to a thickness of 10 micrometers thereonto forsubsequent pre-baking at 75° C. for 30 minutes before exposure at 700mj/cm² prior to a thermosetting at 210° C. for 30 minutes. A glasstransition temperature of the resin after thermosetting was 250° C.

[0067] Subsequently, the resin surface was polished by #320 buff to makethe surface rough for pre-immersion into 20 wt-% hydrochloric acidsolution for 15 minutes before desmear chemicals were used for swelling,etching and neutralizing processes.

[0068] Palladium catalyst is adsorbed onto the rough surface foractivation in the THP process before particle free epoxy-acrylatevarnish having fluorene skeleton was treated in the same manner asdescribed above prior to accomplishment of pre-baking processes forexposure through mask pattern, and subsequent development with kerosinefor 2 minutes prior to the thermosetting.

[0069] This substrate was returned to the THP process for reduction in asolution containing 1 g/l of boron sodium hydride for 10 minutes todeposit metals in the patterns. Subsequent washing by water isaccomplished before immersion into electroless copper plating solutionKC-500 (available from Japan Energy) for 2 hours to deposit 10micrometers-thick electroless copper, and subsequent heat treatment at160° C. for 1 hour.

[0070] 90 degree peel strength test was carried out to confirm astrength of at least 0.9 kg/cm.

EXAMPLE 6

[0071] In place of calcium carbonate-treated bridgepolymethylmethacrylate particles (M-305C, diameter; 5-20 micrometers),hollow polyvinylidene particles (F-104E, diameter; 1-2 micrometers) wereblended at 5 parts by weight to 15 parts by weight of M-305C. Theetching time is reduced by half. Other conditions are the same asExample 5.

[0072] 90 degree peel strength test was carried out to confirm astrength of at least 1 kg/cm.

EXAMPLE 7

[0073] 100 parts by weight of polypropylene resin dried at 90° C. for 1hour were blended with 40 parts by weight of nylon 6/66 particles driedat 75° C. for 4 hours (diameter; 10-20 micrometers) for subsequentmixing at 190° C. by biaxial extruder to form a chip. This chip wasagain dried at 90° C. for 1 hour for subsequent injection molding at190° C. to form a 1.2 mm-thick plate.

[0074] Subsequently, the resin surface was polished by #320 buff to makethe surface rough before desmear chemicals were used for swelling,etching and neutralizing processes.

[0075] Palladium catalyst is adsorbed onto the rough surface foractivation in the THP process before electroless plating for 15 minutesto increase the thickness up to 18 micrometers. Hydrochloric acid isused to subsequently provide palladium to deposit electroless nickelplating at 1 micrometer for further flash gold plating. Heat treatmentwas carried out at 1000° C. for 1 hour.

[0076] 90 degree peel strength test was carried out to confirm astrength of at least 0.9 kg/cm.

EXAMPLE 8

[0077] 100 parts by weight of polymethylpentene resin were solved into500 parts by weight of cyclohexane and then blended with nylon 12particles (orgasole 2001, diameter; 8-12 micrometers, melting point:175-179° C.). Other conditions are the same as Example 7.

[0078] 90 degree peel strength test was carried out to confirm astrength of at least 0.8 kg/cm.

[0079] Whereas modifications of the present invention will be apparentto a person having ordinary skill in the art to which the inventionpertains, it is to be understood that embodiments as shown and describedby way of illustrations are by no means intended to be considered in alimiting sense. Accordingly, it is to be intended to cover by claims allmodifications which fall within the spirit and scope of the presentinvention.

What is claimed is:
 1. A method of forming a conductor on a surface of aresin composition comprising the steps of: molding a resin whichincludes at least any one of insulative organic particles and insulativecomposite particles having an organic component and an inorganiccomponent at a total amount in the range of 5-50% by volume, wherein theorganic particles and the organic component of the composite particlesare allowed to be corroded by either alkali or acid and wherein not lessthan 90% by volume of said at least any one of said insulative organicparticles and said insulative composite particles has a particlediameter in the range of 1-20 micrometers; exposing the resin to atleast any one of an acid solution and an alkali solution to make asurface of the molded resin rough; and subjecting the rough surface ofthe molded resin to an electroless plating for subsequent heat treatmentto the resin.
 2. The method as claimed in claim 1 , wherein the acidsolution and the alkali solution are permanganate and neutralizingsolution thereof.
 3. A resin with resistance to alkali and acidcomprising: a resin matrix comprising an epoxy-acrylate having afluorine skeleton and benzocyclobutene; and at least one of insulativeorganic particles and insulative composite particles; wherein not lessthan 90 percent by volume of said organic particles and said compositeparticles have a particle diameter in the range of 1-20 micrometers, andthe volume of said at least one of said organic particles and saidcomposite particles is in the range of 5-50 percent of the resin volume,said composite particles having an organic component and an inorganiccomponent; said organic particles and said organic component of saidcomposite particles being selected from the group consisting of athermoplastic amorphous polymer having a glass transition temperature ofat least 90° C., a thermoplastic crystalline polymer having a meltingpoint of at least 110° C., and a thermosetting polymer, and said organicparticles and said organic component of said composite particles beingcorrosible by one of an acid or an alkali; and wherein said organicparticles and said organic component of said composite particlescomprise a thermoplastic crystal polymer having a melting point of atleast 110° C.
 4. A resin with resistance to alkali and acid comprising:a resin matrix comprising an epoxy-acrylate having a fluorine skeletonand benzocyclobutene; and at least one of insulative organic particlesand insulative composite particles; wherein not less than 90 percent byvolume of said organic particles and said composite particles have aparticle diameter in the range of 1-20 micrometers, and the volume ofsaid at least one of said organic particles aid said composite particlesis in the range of 5-50 percent of the resin volume, said compositeparticles having an organic component and an inorganic component; saidorganic particles and said organic component of said composite particlesbeing selected from the group consisting of a thermoplastic amorphouspolymer having a glass transition temperature of at least 90° C., athermoplastic crystalline polymer having a melting point of at least110° C., and a thermosetting polymer, and said organic particles andsaid organic component of said composite particles being corrosible byone of an acid or an alkali; and wherein said organic particles and saidorganic component of said composite particles comprise a thermosettingpolymer.
 5. A resin with resistance to alkali and acid comprising: aresin matrix comprising an epoxy-acrylate having a fluorine skeleton andbenzocyclobutene; and at least one of insulative organic particles andinsulative composite particles; wherein not less than 90 percent byvolume of said organic particles and said composite particles have aparticle diameter in the range of 1-20 micrometers, and the volume ofsaid at least one of said organic particles and said composite particlesis in the range of 5-50 percent of the resin volume, said compositeparticles having an organic component and an inorganic component; saidorganic particles and said organic component of said composite particlesbeing selected from the group consisting of a thermoplastic amorphouspolymer having a glass transition temperature of at least 90° C., athermoplastic crystalline polymer having a melting point of at least110° C., and a thermosetting polymer, and said organic particles andsaid organic component of said composite particles being corrosible byone of an acid or an alkali; and wherein each of said compositeparticles comprise inorganic core particles coated with a thermoplasticpolymer layer.
 6. A resin with resistance to alkali and acid comprising:a resin matrix comprising an epoxy-acrylate having a fluorine skeletonand benzocyclobutene; and at least one of insulative organic particlesand insulative composite particles; wherein not less than 90 percent byvolume of said organic particles and said composite particles have aparticle diameter in the range of 1-20 micrometers, and the volume ofsaid at least one of said organic particles and said composite particlesis in the range of 5-50 percent of the resin volume, said compositeparticles having an organic component and an inorganic component; saidorganic particles and said organic component of said composite particlesbeing selected from the group consisting of a thermoplastic amorphouspolymer having a glass transition temperature of at least 90° C., athermoplastic crystalline polymer having a melting point of at least110° C., and a thermosetting polymer, and said organic particles andsaid organic component of said composite particles being corrosible byone of an acid or an alkali; and wherein each of said compositeparticles comprise inorganic core particles coated with a thermosettingpolymer layer.
 7. A resin with resistance to alkali and acid comprising:a resin matrix comprising an epoxy-acrylate having a fluorine skeletonand benzocyclobutene; and at least one of insulative organic particlesand insulative composite particles; wherein not less than 90 percent byvolume of said organic particles and said composite particles have aparticle diameter in the range of 1-20 micrometers, and the volume ofsaid at least one of said organic particles and said composite particlesis in the range of 5-50 percent of the resin volume, said compositeparticles having an organic component and an inorganic component; saidorganic particles and said organic component of said composite particlesbeing selected from the group consisting of a thermoplastic amorphouspolymer having a glass transition temperature of at least 90° C., athermoplastic crystalline polymer having a melting point of at least110° C., and a thermosetting polymer, and said organic particles andsaid organic component of said composite particles being corrosible byone of an acid or an alkali; wherein said organic particles and saidcomposite particles comprise hollow particles; wherein said hollowparticles each have a coating of calcium carbonate, the weight of saidcoating being 25 percent or less of the weight of said hollow particle;and wherein said organic particles and said organic component of saidcomposite particles are at least one thermosetting polymer selected fromthe group consisting of epoxy resin, phenol resin, and diarylphthalateresin.